发明授权
US06525755B1 Thick film thermal head 失效
厚膜热头

  • 专利标题: Thick film thermal head
  • 专利标题(中): 厚膜热头
  • 申请号: US09635658
    申请日: 2000-08-10
  • 公开(公告)号: US06525755B1
    公开(公告)日: 2003-02-25
  • 发明人: Ryoichi ImaiJunichi Terauchi
  • 申请人: Ryoichi ImaiJunichi Terauchi
  • 优先权: JP11-227328 19990811; JP2000-214657 20000714
  • 主分类号: B41J2335
  • IPC分类号: B41J2335
Thick film thermal head
摘要:
A thick film thermal head includes a substrate which is provided with a linear groove and is heat-conductive at least at a part of the surface facing the groove. An elongated resistance heater is embedded in the groove to be in contact with the part of the surface of the substrate at which the substrate is heat-conductive, and a plurality of electrodes are formed on the surface of the substrate in contact with the resistance heater and arranged in the longitudinal direction of the resistance heater.
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