发明授权
- 专利标题: Thick film thermal head
- 专利标题(中): 厚膜热头
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申请号: US09635658申请日: 2000-08-10
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公开(公告)号: US06525755B1公开(公告)日: 2003-02-25
- 发明人: Ryoichi Imai , Junichi Terauchi
- 申请人: Ryoichi Imai , Junichi Terauchi
- 优先权: JP11-227328 19990811; JP2000-214657 20000714
- 主分类号: B41J2335
- IPC分类号: B41J2335
摘要:
A thick film thermal head includes a substrate which is provided with a linear groove and is heat-conductive at least at a part of the surface facing the groove. An elongated resistance heater is embedded in the groove to be in contact with the part of the surface of the substrate at which the substrate is heat-conductive, and a plurality of electrodes are formed on the surface of the substrate in contact with the resistance heater and arranged in the longitudinal direction of the resistance heater.
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