发明授权
US06528231B1 PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
失效
感光性树脂组合物，印刷线路板，用于处理半导体芯片的基板，用于制造印刷电路板的半导体器件和工艺，用于处理半导体器件的衬底和半导体器件
- 专利标题： PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
- 专利标题（中）： 感光性树脂组合物，印刷线路板，用于处理半导体芯片的基板，用于制造印刷电路板的半导体器件和工艺，用于处理半导体器件的衬底和半导体器件
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申请号： US09490627申请日： 2000-01-24
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公开(公告)号： US06528231B1公开(公告)日： 2003-03-04
- 发明人: Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
- 申请人： Yusuke Tajima , Kazuo Takeuchi , Yasuo Shigemitsu , Etsu Takeuchi
- 优先权： JP11-015176 19990125; JP11-147097 19990526
- 主分类号： G03C173
- IPC分类号： G03C173
摘要：
A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.