Invention Grant
US06530146B2 Apparatus for mounting a flipchip on a work piece 失效
用于将倒装芯片安装在工件上的装置

  • Patent Title: Apparatus for mounting a flipchip on a work piece
  • Patent Title (中): 用于将倒装芯片安装在工件上的装置
  • Application No.: US09871110
    Application Date: 2001-05-31
  • Publication No.: US06530146B2
    Publication Date: 2003-03-11
  • Inventor: Daniel Link
  • Applicant: Daniel Link
  • Priority: EP00810550 20000622
  • Main IPC: B23B1900
  • IPC: B23B1900
Apparatus for mounting a flipchip on a work piece
Abstract:
An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.
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