Invention Grant
- Patent Title: Apparatus for mounting a flipchip on a work piece
- Patent Title (中): 用于将倒装芯片安装在工件上的装置
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Application No.: US09871110Application Date: 2001-05-31
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Publication No.: US06530146B2Publication Date: 2003-03-11
- Inventor: Daniel Link
- Applicant: Daniel Link
- Priority: EP00810550 20000622
- Main IPC: B23B1900
- IPC: B23B1900

Abstract:
An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.
Public/Granted literature
- US20010054229A1 Apparatus for mounting a flipchip on a work piece Public/Granted day:2001-12-27
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