发明授权
- 专利标题： Hermetic seal in microelectronic devices
- 专利标题（中）： 微电子器件密封
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申请号： US09930228申请日： 2001-08-16
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公开(公告)号： US06530649B1公开(公告)日： 2003-03-11
- 发明人: Alfred I-Tsung Pan
- 申请人： Alfred I-Tsung Pan
- 主分类号： B41J205
- IPC分类号： B41J205
摘要：
A carrier includes a substrate formed to accept microelectronic chips at various pockets in the substrate. The microelectronic chips are hermetically sealed within the substrate by a deposition process using localized energy supplied at gaps between the chips and the pockets. During the heating process, seal material is deposited in the gaps to form the hermetic seals.
公开/授权文献
- US20030035025A1 HERMETIC SEAL IN MICROELECTRONIC DEVICES 公开/授权日：2003-02-20
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