发明授权
- 专利标题： High-frequency module
- 专利标题（中）： 高频模块
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申请号： US09653194申请日： 2000-08-31
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公开(公告)号： US06531775B1公开(公告)日： 2003-03-11
- 发明人: Kazuhiko Kobayashi , Yoshiaki Sano
- 申请人： Kazuhiko Kobayashi , Yoshiaki Sano
- 优先权： JP11-310159 19991029
- 主分类号： H01L2334
- IPC分类号： H01L2334
摘要：
A high-frequency module includes a substrate including a thin film resin sheet. A high-frequency circuit wiring line forming a first wiring layer is formed and a high-frequency circuit component is provided on an upper surface of the substrate. A resin sealing package seals the first wiring layer and the high-frequency circuit component.