发明授权
- 专利标题: Substrate processing apparatus and substrate processing method
- 专利标题(中): 基板加工装置及基板处理方法
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申请号: US09635465申请日: 2000-08-11
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公开(公告)号: US06532975B1公开(公告)日: 2003-03-18
- 发明人: Yuji Kamikawa , Kouji Egashira , Koji Tanaka
- 申请人: Yuji Kamikawa , Kouji Egashira , Koji Tanaka
- 优先权: JP11-229319 19990813; JP11-326084 19991116
- 主分类号: B08B300
- IPC分类号: B08B300
摘要:
An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.
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