发明授权
- 专利标题: Inorganic reinforced polyamide resin compositions
- 专利标题(中): 无机增强聚酰胺树脂组合物
-
申请号: US09672807申请日: 2000-09-28
-
公开(公告)号: US06534583B1公开(公告)日: 2003-03-18
- 发明人: Tutomu Tamura , Hideki Eguchi , Tomohide Nakagawa , Toshio Hiramatsu , Manabu Takeuchi
- 申请人: Tutomu Tamura , Hideki Eguchi , Tomohide Nakagawa , Toshio Hiramatsu , Manabu Takeuchi
- 优先权: JP11-277395 19990929; JP2000-070433 20000314; JP2000-257540 20000828
- 主分类号: C08L7700
- IPC分类号: C08L7700
摘要:
There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
信息查询