Invention Grant
- Patent Title: Connection module
- Patent Title (中): 连接模块
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Application No.: US09930767Application Date: 2001-08-16
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Publication No.: US06536872B2Publication Date: 2003-03-25
- Inventor: Richard Louis Goin , Steven Robert Komplin , Brian David Smith , Brandon Sung-Hwan Song
- Applicant: Richard Louis Goin , Steven Robert Komplin , Brian David Smith , Brandon Sung-Hwan Song
- Main IPC: B41J201
- IPC: B41J201

Abstract:
A connection module including a base including a forward set of points located in a forward plane and a rearward set of points located in a rearward plane, the forward and rearward planes defining a junction therebetween. The connection module further includes a cable including a plurality of contacts located thereon, each contact being shaped and located to engage one of the points. The connection module has a backing element including a piece of sheet-like material, a set of contact protrusions on the piece of material, and at least one stiffening element on the piece of material. Each of the contact protrusions is shaped and located to engage the cable and urge one of the contacts into engagement with one of the points. The stiffening element is generally aligned with the junction when the contact protrusions engage the cable and urge the contacts into engagement with one of the points.
Public/Granted literature
- US20030035026A1 CONNECTION MODULE Public/Granted day:2003-02-20
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