Invention Grant
- Patent Title: Method for manufacturing raised electrical contact pattern of controlled geometry
- Patent Title (中): 制造受控几何形状的凸起电接触图案的方法
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Application No.: US09848854Application Date: 2001-05-04
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Publication No.: US06538214B2Publication Date: 2003-03-25
- Inventor: Igor Y. Khandros
- Applicant: Igor Y. Khandros
- Main IPC: H05K702
- IPC: H05K702

Abstract:
An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.
Public/Granted literature
- US20020023773A1 Method for manufacturing raised electrical contact patten of controlled geometry Public/Granted day:2002-02-28
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