Invention Grant
- Patent Title: Method of forming a head gimbal assembly
- Patent Title (中): 形成头部万向节组件的方法
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Application No.: US09898213Application Date: 2001-07-02
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Publication No.: US06539609B2Publication Date: 2003-04-01
- Inventor: Darrell D. Palmer , A. David Erpelding , Oscar J. Ruiz , Surya Pattanaik
- Applicant: Darrell D. Palmer , A. David Erpelding , Oscar J. Ruiz , Surya Pattanaik
- Main IPC: G11B5127
- IPC: G11B5127

Abstract:
A method for forming a head gimbal assembly in which the head gimbal assembly and a frame are formed from a continuous piece of laminated material comprised of a first layer, a second layer and a third layer. A plurality of electrical lines are formed in the third layer of the head gimbal assembly and a plurality of electrical line extensions are formed in the third layer of the frame. The slider is positioned at an angle to the frame and a plurality of termination pads on the slider are bonded to the electrical lines. The frame is partially separated from the head gimbal assembly and the relative position of the slider to the head gimbal assembly is changed by an amount sufficient to separate the plurality of electrical lines from the plurality of electrical line extensions.
Public/Granted literature
- US20010039716A1 Head gimbal assembly with integrated electrical conductors Public/Granted day:2001-11-15
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