In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.