发明授权
- 专利标题： Method and apparatus for plating a substrate
- 专利标题（中）： 电镀基板的方法和装置
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申请号： US09145500申请日： 1998-09-02
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公开(公告)号： US06544585B1公开(公告)日： 2003-04-08
- 发明人: Fumio Kuriyama , Akihisa Hongo , Hiroaki Inoue , Tsuyoshi Tokuoka
- 申请人： Fumio Kuriyama , Akihisa Hongo , Hiroaki Inoue , Tsuyoshi Tokuoka
- 优先权： JP9-265027 19970911; JP9-267854 19970912; JP9-269300 19970916; JP9-269305 19970916; JP9-252758 19970902; JP9-334902 19971119
- 主分类号： B05D512
- IPC分类号： B05D512
摘要：
A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method involves immersing the substrate in a liquid held in a processing chamber, evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities, and subjecting the liquid to boiling in at least those regions adjacent to the substrate.