发明授权
- 专利标题: Method of peeling off coating of insulated conductive wires
- 专利标题(中): 剥离绝缘导线涂层的方法
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申请号: US09538936申请日: 2000-03-31
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公开(公告)号: US06546617B1公开(公告)日: 2003-04-15
- 发明人: Mitsuyuki Hayashi , Katsumi Shizu , Masaru Sugiyama , Yoshio Naka , Kazuki Maesoba
- 申请人: Mitsuyuki Hayashi , Katsumi Shizu , Masaru Sugiyama , Yoshio Naka , Kazuki Maesoba
- 优先权: JP11-096487 19990402; JP11-195503 19990709; JP2000-035674 20000208
- 主分类号: H01B4300
- IPC分类号: H01B4300
摘要:
A method of peeling off a coating of an elliptical cross sectional insulated conductive wire has a groove forming process of forming a groove nearly perpendicular to a longitudinal direction of the insulated conductive wire at given positions within a peeling region thereof, a first peeling process of peeling off the coating by moving a pair of first cutting edges in a longitudinal direction of the insulated conductive wire and perpendicularly to a longer diameter direction of the cross section thereof toward the groove from opposite ends of the peeling region, and a second peeling process of peeling off the coating at the peeling region by moving a pair of second cutting edges in a direction perpendicular to the longitudinal direction and in parallel with the longer diameter direction of the cross section thereof. As a result, the coating all around the outer circumference of the insulated conductive wire at the peeling region may be completely peeled off.
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