Invention Grant
US06548947B2 Method of fabricating row lines of a field emission array and forming pixel openings therethrough
失效
制造场致发射阵列的行线并形成穿过其中的像素开口的方法
- Patent Title: Method of fabricating row lines of a field emission array and forming pixel openings therethrough
- Patent Title (中): 制造场致发射阵列的行线并形成穿过其中的像素开口的方法
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Application No.: US09879785Application Date: 2001-06-12
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Publication No.: US06548947B2Publication Date: 2003-04-15
- Inventor: Ammar Derraa
- Applicant: Ammar Derraa
- Main IPC: H01J702
- IPC: H01J702

Abstract:
A method for fabricating row lines over a field emission array in which two mask steps are used to define row lines and pixel openings through selected regions of each row line. A first mask may be employed in the removal of dielectric material and conductive material from between pixel rows and from substantially above each pixel of the field emission array. A second mask may be used in the removal of semiconductor material from between the adjacent rows of pixels. Alternatively, a first mask may be employed in the definition of row lines, while a second mask may be used in the formation of pixel openings. Field emission arrays having a semiconductive grid and a relatively thin passivation layer exposed between adjacent row lines are also disclosed.
Public/Granted literature
- US20010030496A1 Method of fabricating row lines of a field emission array and forming pixel openings therethrough Public/Granted day:2001-10-18
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