发明授权
US06555453B1 Fully nickel silicided metal gate with shallow junction formed 有权
全镍硅化金属栅极,形成浅结

Fully nickel silicided metal gate with shallow junction formed
摘要:
Semiconductor devices having fully metal silicided gate electrodes, and methods for making the same, are disclosed. The devices have shallow S/D extensions with depths of less than about 500 Å. The methods for making the subject semiconductor devices employ diffusion of dopant from metal suicides to form shallow S/D extensions, followed by high energy implantation and activation, and metal silicidation to form S/D junctions having metal silicide connect regions and a fully metal silicided electrode.
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