发明授权
US06556477B2 Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same
有权
具有SRAM,DRAM和闪速存储器的集成芯片及其制造方法
- 专利标题: Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same
- 专利标题(中): 具有SRAM,DRAM和闪速存储器的集成芯片及其制造方法
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申请号: US09861788申请日: 2001-05-21
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公开(公告)号: US06556477B2公开(公告)日: 2003-04-29
- 发明人: Louis L. Hsu , Carl Radens , Li-Kong Wang
- 申请人: Louis L. Hsu , Carl Radens , Li-Kong Wang
- 主分类号: G11C1134
- IPC分类号: G11C1134
摘要:
A semiconductor memory system fabricated on one substrate is presented including an SRAM device, a DRAM device and a Flash memory device. In one embodiment the SRAM device is a high-resistive load SRAM device. In another embodiment the DRAM device is a deep trench DRAM device. A method is also presented for fabricating the memory system on one substrate having the SRAM device, the DRAM device and the Flash memory device.
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