发明授权
US06556477B2 Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same 有权
具有SRAM,DRAM和闪速存储器的集成芯片及其制造方法

  • 专利标题: Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same
  • 专利标题(中): 具有SRAM,DRAM和闪速存储器的集成芯片及其制造方法
  • 申请号: US09861788
    申请日: 2001-05-21
  • 公开(公告)号: US06556477B2
    公开(公告)日: 2003-04-29
  • 发明人: Louis L. HsuCarl RadensLi-Kong Wang
  • 申请人: Louis L. HsuCarl RadensLi-Kong Wang
  • 主分类号: G11C1134
  • IPC分类号: G11C1134
Integrated chip having SRAM, DRAM and flash memory and method for fabricating the same
摘要:
A semiconductor memory system fabricated on one substrate is presented including an SRAM device, a DRAM device and a Flash memory device. In one embodiment the SRAM device is a high-resistive load SRAM device. In another embodiment the DRAM device is a deep trench DRAM device. A method is also presented for fabricating the memory system on one substrate having the SRAM device, the DRAM device and the Flash memory device.
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