A method of implementing a new reticle for manufacturing semiconductors on a wafer which involves performing measurements on the reticle and assigning an initial exposure dose by using a predetermined algorithm. The exposure control system utilizes reticle CD data for automatically calculating reticle exposure offset values, i.e. reticle factors. A correlation of reticle size deviations to calculated reticle factors is used to derive a reticle factor for the new reticle. The derived reticle factor is then used to predict an initial exposure condition for the new reticle which is applied to the lithography tool for achieving a wafer design dimension.