发明授权
US06557237B1 Removable modular cell for electro-chemical plating and method 失效
用于电化学电镀的可拆卸模块和方法

  • 专利标题: Removable modular cell for electro-chemical plating and method
  • 专利标题(中): 用于电化学电镀的可拆卸模块和方法
  • 申请号: US09663814
    申请日: 2000-09-15
  • 公开(公告)号: US06557237B1
    公开(公告)日: 2003-05-06
  • 发明人: Donald J. K. Olgado
  • 申请人: Donald J. K. Olgado
  • 主分类号: H01S400
  • IPC分类号: H01S400
Removable modular cell for electro-chemical plating and method
摘要:
The present invention relates to a method and apparatus for depositing metal on a substrate. More particularly, one embodiment of the metal deposition cell comprising a cell base, an anode, and a cell top. The cell base at least partially defines an interior recess. The anode mounted within the interior recess to the cell base. The cell top is removably mounted to the cell base. In one embodiment, a method of removing a modular metal deposition cell from a deposition cell mount is provided. The modular metal deposition cell comprises a cell top and a cell bottom. The method comprises: unfastening a fastener that secures the cell top to the cell bottom, and also fastens the cell top and the cell bottom to the deposition cell mount. The cell top or the cell bottom are then removed from the deposition cell mount.
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