发明授权
- 专利标题: Stack of multilayer modules with heat-focusing metal layer
- 专利标题(中): 堆叠具有热聚焦金属层的多层模块
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申请号: US09949024申请日: 2001-09-07
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公开(公告)号: US06560109B2公开(公告)日: 2003-05-06
- 发明人: James Satsuo Yamaguchi , Angel Antonio Pepe , Volkan H. Ozguz , Andrew Nelson Camien
- 申请人: James Satsuo Yamaguchi , Angel Antonio Pepe , Volkan H. Ozguz , Andrew Nelson Camien
- 主分类号: H05K720
- IPC分类号: H05K720
摘要:
A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.