发明授权
US06562653B1 Silicon interposer and multi-chip-module (MCM) with through substrate vias
有权
硅插入器和多芯片模块（MCM），通过基板通孔
- 专利标题： Silicon interposer and multi-chip-module (MCM) with through substrate vias
- 专利标题（中）： 硅插入器和多芯片模块（MCM），通过基板通孔
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申请号： US09668770申请日： 2000-09-22
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公开(公告)号： US06562653B1公开(公告)日： 2003-05-13
- 发明人: Qing Ma , Harry Fujimoto
- 申请人： Qing Ma , Harry Fujimoto
- 主分类号： H01L2150
- IPC分类号： H01L2150
摘要：
An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silicon subtstrate. The silicon substrate has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the integrated circuit.
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