- 专利标题: Microelectronic assembly with die support and method
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申请号: US09819393申请日: 2001-03-28
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公开(公告)号: US06562663B2公开(公告)日: 2003-05-13
- 发明人: Steven M. Scheifers , Andrew Skipor , Daniel Gamota
- 申请人: Steven M. Scheifers , Andrew Skipor , Daniel Gamota
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.
公开/授权文献
- US20020142514A1 Microelectronic assembly with die support and method 公开/授权日:2002-10-03
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