- 专利标题： Printed circuit board and method for manufacturing same
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申请号： US09501296申请日： 2000-02-09
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公开(公告)号： US06563057B2公开(公告)日： 2003-05-13
- 发明人: Sinichi Hotta , Hisaya Takahashi
- 申请人： Sinichi Hotta , Hisaya Takahashi
- 优先权： JP11-032908 19990210
- 主分类号： H05K111
- IPC分类号： H05K111
摘要：
In a multilayer printed circuit board having a conductor pattern, covered with an insulation layer having via holes, these via holes are filled with a conductor by means of electroless nickel plating or electroless copper plating.
公开/授权文献
- US20020112885A1 Printed circuit board and method for manufacturing same 公开/授权日：2002-08-22
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