发明授权
- 专利标题: Multilayered circuit board and method for producing the same
- 专利标题(中): 多层电路板及其制造方法
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申请号: US09802752申请日: 2001-03-08
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公开(公告)号: US06563058B2公开(公告)日: 2003-05-13
- 发明人: Yasuhiko Mizutani , Takami Hirai , Kazuyuki Mizuno
- 申请人: Yasuhiko Mizutani , Takami Hirai , Kazuyuki Mizuno
- 优先权: JP2000-067378 20000310
- 主分类号: H05K111
- IPC分类号: H05K111
摘要:
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled with a material having a high dielectric constant respectively in a capacitor-forming area, and a plurality of (for example, four) holes are filled with a material having a high magnetic permeability respectively so as to penetrate through first to fifth dielectric layers in a magnetic flux-passing area of a coil constructed by coil electrodes of first to fifth turns in a coil-forming area.