发明授权
US06563058B2 Multilayered circuit board and method for producing the same 有权
多层电路板及其制造方法

Multilayered circuit board and method for producing the same
摘要:
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled with a material having a high dielectric constant respectively in a capacitor-forming area, and a plurality of (for example, four) holes are filled with a material having a high magnetic permeability respectively so as to penetrate through first to fifth dielectric layers in a magnetic flux-passing area of a coil constructed by coil electrodes of first to fifth turns in a coil-forming area.
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