Invention Grant
- Patent Title: High density RJ connector assembly
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Application No.: US09954583Application Date: 2001-09-17
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Publication No.: US06565391B2Publication Date: 2003-05-20
- Inventor: Elliot Bernstein , John Chen
- Applicant: Elliot Bernstein , John Chen
- Main IPC: H01R13514
- IPC: H01R13514

Abstract:
A modular connector having a housing with one or more compartments, each compartment being structured and arranged to receive a plug. Within the housing are one or more conductive planes. Preferably, there are two conductive planes, a voltage source plane and a voltage ground plane. These source and ground planes are provided on a printed circuit board within the housing. The source and ground planes create a low impedance path for the source and ground connections by directly connecting the source and ground planes to a system printed circuit board of the equipment unit by a common voltage source pin and a common voltage ground pin, each of which extend from the housing. The voltage source connections and the voltage ground connections for each RJ jack are respectively connected to the voltage source plane and the voltage ground plane such that each of the RJ jacks share a common voltage source and ground. Accordingly, when multiport RJ connectors are formed, the use of the common source and ground planes operates to reduce the number of pins in each RJ unit by requiring only one voltage source pin and one voltage ground pin regardless of the number of RJ jacks in the multiport connector.
Public/Granted literature
- US20020090862A1 High density RJ connector assembly Public/Granted day:2002-07-11
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