发明授权
US06565422B1 Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
失效
抛光装置使用抛光单元附近的混合单元使用基本上无磨料的液体，以及使用抛光装置的设备
- 专利标题： Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
- 专利标题（中）： 抛光装置使用抛光单元附近的混合单元使用基本上无磨料的液体，以及使用抛光装置的设备
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申请号： US09507787申请日： 2000-02-22
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公开(公告)号： US06565422B1公开(公告)日： 2003-05-20
- 发明人: Yoshio Homma , Hiroki Nezu , Takeshi Kimura , Seiichi Kondo , Noriyuki Sakuma
- 申请人： Yoshio Homma , Hiroki Nezu , Takeshi Kimura , Seiichi Kondo , Noriyuki Sakuma
- 优先权： JP11-041046 19990219
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
In order to resolve problems of an increase in cost of transportation and vessels for polishing solutions to polish metal films, and of aging change of the polishing solutions, apparatus for preparing and mixing solutions of polishing materials without including abrasive are installed at a site the same as a site of polishing apparatus, an abrasive free slurry is supplied to the polishing apparatus and a metal film on a wiring substrate is polished to thereby form embedded metal wirings by which the cost of polishing metal can significantly be reduced and stability of the polishing solution is promoted.