Invention Grant
US06566213B2 Method of fabricating multi-thickness silicide device formed by disposable spacers
失效
制造由一次性间隔物形成的多层硅化物装置的方法
- Patent Title: Method of fabricating multi-thickness silicide device formed by disposable spacers
- Patent Title (中): 制造由一次性间隔物形成的多层硅化物装置的方法
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Application No.: US09824123Application Date: 2001-04-02
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Publication No.: US06566213B2Publication Date: 2003-05-20
- Inventor: William G. En , Srinath Krishnan , Dong-Hyuk Ju , Bin Yu
- Applicant: William G. En , Srinath Krishnan , Dong-Hyuk Ju , Bin Yu
- Main IPC: H01L21336
- IPC: H01L21336

Abstract:
A transistor device formed on a semiconductor-on-insulator (SOI) substrate with a buried oxide (BOX) layer disposed thereon and an active layer disposed on the BOX layer having active regions defined by isolation trenches. The device includes a gate defining a channel interposed between a source and a drain formed within the active region of the SOI substrate. Further, the device includes a plurality of thin silicide layers formed on the source and the drain. Additionally, at least an upper silicide layer of the plurality of thin silicide layers extends beyond a lower silicide layer. Further still, the device includes a disposable spacer used in the formation of the device. The device further includes a second plurality of thin silicide layers formed on a polysilicon electrode of the gate.
Public/Granted literature
- US20020142524A1 Multi-thickness silicide device formed by disposable spacers Public/Granted day:2002-10-03
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