发明授权
- 专利标题： Powder metal polymer organic sheet punching for substrate conductors
- 专利标题（中）： 粉末金属聚合物有机片冲孔基板导体
-
申请号： US09408355申请日： 1999-09-29
-
公开(公告)号： US06569278B1公开(公告)日： 2003-05-27
- 发明人: David H. Gabriels , James Humenik , John U. Knickerbocker , David C. Long
- 申请人： David H. Gabriels , James Humenik , John U. Knickerbocker , David C. Long
- 主分类号： B32B3100
- IPC分类号： B32B3100
摘要：
A method and structure for filling an opening in a substrate which includes positioning a sheet above the substrate and punching the sheet into the opening in the substrate, wherein the sheet and the substrate have similar shrinkage characteristics when subjected to a subsequent sintering process.
信息查询
