发明授权
US06569764B1 Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
失效
通过经由突出电极和树脂材料的绝缘片将引线框架附接到半导体芯片来制造半导体封装的方法
- 专利标题： Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
- 专利标题（中）： 通过经由突出电极和树脂材料的绝缘片将引线框架附接到半导体芯片来制造半导体封装的方法
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申请号： US09650076申请日： 2000-08-29
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公开(公告)号： US06569764B1公开(公告)日： 2003-05-27
- 发明人: Toshinori Hirashima , Yasushi Takahashi , Ryoichi Kajiwara , Masahiro Koizumi , Munehisa Kishimoto
- 申请人： Toshinori Hirashima , Yasushi Takahashi , Ryoichi Kajiwara , Masahiro Koizumi , Munehisa Kishimoto
- 优先权： JP11-238859 19990825
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
The semiconductor device includes a semiconductor chip having a first electrode and a second electrode formed on a first main surface and a third electrode formed on a second main surface opposite the first main surface. A first portion of a first lead is placed on the first electrode and a second portion of the first lead is located outside the semiconductor chip. A first portion of a second lead is placed on the second electrode and a second portion of the second lead is located outside the semiconductor chip. A plurality of projecting electrodes are provided between the first portion of the first lead and the first electrode and between the first portion of the second lead and the second electrode to electrically connect them. An insulating sheet is provided between the first portion of the first lead and the first main surface of the semiconductor chip and between the first portion of the second lead and the first main surface of the semiconductor chip. The insulating sheet covers the first main surface of the semiconductor chip in areas other than a region in which the plurality of projecting electrodes are provided.
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