发明授权
- 专利标题: Circuit board assembly having a compact structure
- 专利标题(中): 具有紧凑结构的电路板组件
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申请号: US09960150申请日: 2001-09-20
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公开(公告)号: US06570775B2公开(公告)日: 2003-05-27
- 发明人: Chia Ching Lai
- 申请人: Chia Ching Lai
- 主分类号: H05K700
- IPC分类号: H05K700
摘要:
A circuit board device includes a secondary circuit board supported on a primary circuit board and parallel to the primary circuit board for forming a compact structure. The secondary circuit board includes one end coupler for coupling to another coupler of the primary circuit board, and the other end having one or more rods supported on a frame for allowing the secondary circuit board to be stably supported on the primary circuit board. A housing may prevent the secondary circuit board from being interfered by the electromagnetic field of the primary circuit board.
公开/授权文献
- US20030053303A1 Circuit board assembly having a compact structure 公开/授权日:2003-03-20
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