- 专利标题： Shielded electronics package structure with enhanced mechanical reliability
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申请号： US09884110申请日： 2001-06-20
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公开(公告)号： US06570776B2公开(公告)日： 2003-05-27
- 发明人: James D. MacDonald, Jr. , Walter M. Marcinkiewicz
- 申请人： James D. MacDonald, Jr. , Walter M. Marcinkiewicz
- 主分类号： H05K900
- IPC分类号： H05K900
摘要：
A circuit shielding structure includes a circuitry package and a layer of conductive polymer material coating at least a portion of the circuitry package. The layer of conductive polymer material may include a metal filled polymer such as a silver particle filled fluoroelastomer.
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