A low-cost tamper-resistant product package is provided. The package comprises a substantially flat thermoplastic sheet forming a package backing, and a molded plastic cover sealed to the backing. The backing and cover are preferably formed of a plastic, such as polyvinyl chloride or polyethylene, that is difficult to puncture, cut or tear. The seal between the backing and cover is preferably difficult to compromise, so that human hands have great difficulty separating the backing and cover. RF welding and ultrasonic welding are preferred methods of sealing the package. The plastic backing is adapted to be printed upon directly. The cover preferably includes a ridge around its perimeter to inhibit bending of the package and assist in package display. The cover also preferably includes at least one bulge, forming therein a hollow recess for housing a product.