发明授权
- 专利标题： Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface
- 专利标题（中）： 用于在将金属电镀沉积到半导体晶片表面上时控制污染的方法和装置
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申请号： US09965739申请日： 2001-09-28
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公开(公告)号： US06573183B2公开(公告)日： 2003-06-03
- 发明人: Sailesh Mansinh Merchant , Minseok Oh , Deepak A. Ramappa
- 申请人： Sailesh Mansinh Merchant , Minseok Oh , Deepak A. Ramappa
- 主分类号： H01L21449
- IPC分类号： H01L21449
摘要：
A method and apparatus for the electroplating deposition of a metal onto a semiconductor wafer surface (29), including vibrationally scrubbing the wafer surface (29) during an electroplating process. At least one transducer (32) is mounted to a wall (33) of an electroplating tool chamber (22). The transducer (32) intermittently delivers sonic energy pulses lasting for one to two seconds to the electroplating solution during the electroplating process.
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