- 专利标题: Room temperature-curing organopolysiloxane composition
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申请号: US09955079申请日: 2001-09-19
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公开(公告)号: US06573356B2公开(公告)日: 2003-06-03
- 发明人: Tadashi Araki , Norio Kameda , Tsuneo Kimura
- 申请人: Tadashi Araki , Norio Kameda , Tsuneo Kimura
- 优先权: JP2000-285994 20000920
- 主分类号: C08G7726
- IPC分类号: C08G7726
摘要:
A room temperature-curing organopolysiloxane composition including (A) 100 parts by weight of at least one of two specific organopolysiloxanes; (B) 0.1 to 30 parts by weight of a silane compound having in its molecule an average of at least two Si-bonded hydrolyzable groups and in which the remaining Si-bonded group(s) is/are a group(s) selected from the group consisting of methyl, ethyl, propyl, vinyl and phenyl groups; a partial hydrolysis-condensation product thereof; or a mixture of these; and (C) 0.1 to 10 parts by weight of a mixture of siloxanes having degrees of polymerization of 2 to 10. The mixture of siloxanes is a partial hydrolysis-condensation product of a silane compound having a group selected from amino, epoxy, mercapto, acryloyl and methacryloyl groups each bonded to the silicon atom through a carbon atom and having a Si-bonded hydrolyzable group. The composition has superior adhesion to various resins.
公开/授权文献
- US20020065385A1 Room temperature-curing organopolysiloxane composition 公开/授权日:2002-05-30
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