发明授权
- 专利标题: Welding method for semiconductor materials
- 专利标题(中): 半导体材料焊接方法
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申请号: US09216275申请日: 1998-12-18
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公开(公告)号: US06573471B1公开(公告)日: 2003-06-03
- 发明人: Kazuya Kuriyama , Yoichiro Hanada
- 申请人: Kazuya Kuriyama , Yoichiro Hanada
- 优先权: JP9-365188 19971219
- 主分类号: B23K1500
- IPC分类号: B23K1500
摘要:
Two overlapped semiconductor materials are welded by a melt welding under the influence of a heat source of high energy density. The energy output of the heat source is ramped up slowly at the beginning of welding and ramped down slowly at completion of welding. In one embodiment the semiconductor materials are preheated before welding. In another embodiment, the effective position of the heat source on the semiconductor materials is periodically deflected.