In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet is removed from continuously arranged circuit patterns of a first PCB sheet. After removal of the defective circuit pattern sheet, the first PCB sheet is position-located by a position locator. Then, the space which is formed by removing, the defective circuit pattern sheet is filled with a second PCB sheet on which a good quality circuit pattern is printed. Then, the first PCB sheet and the second PCB sheet are coupled together by using an adhesive.