Invention Grant
- Patent Title: Silicon carbide semiconductor device and manufacturing method
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Application No.: US10135522Application Date: 2002-05-01
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Publication No.: US06576929B2Publication Date: 2003-06-10
- Inventor: Rajesh Kumar , Takamasa Suzuki
- Applicant: Rajesh Kumar , Takamasa Suzuki
- Priority: JP2001-137822 20010508; JP2001-151594 20010521
- Main IPC: H01K2978
- IPC: H01K2978

Abstract:
A channel layer 4 is formed on an n−-type epitaxial layer 2 and first gate areas 3, and field enhanced area(s) 5 and second gate areas 6 are formed on the first gate areas 3. Furthermore, n+-type source areas 7 and a third gate area 8 are formed on the second gate areas 6. These steps result in a device structure having a first J-FET with the n+-type source areas 7 and the n+-type substrate 1 as a source and drain and the first gate areas 3 at the right and left in the figure as a gate; and the second J-FET with the n+-type source areas 7 and the n+-type substrate 1 as a source and drain and the second gate areas 6 and the third gate area 8 as a gate. The first J-FET is normally-on, while the second J-FET is normally-off.
Public/Granted literature
- US20020167011A1 Silicon carbide semiconductor device and manufacturing method Public/Granted day:2002-11-14
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