发明授权
US06579393B2 High thermal conductivity lossy dielectric using co-densified multilayer configuration 失效
使用共密集多层构造的高导热系数有损介质

  • 专利标题: High thermal conductivity lossy dielectric using co-densified multilayer configuration
  • 专利标题(中): 使用共密集多层构造的高导热系数有损介质
  • 申请号: US09837891
    申请日: 2001-04-18
  • 公开(公告)号: US06579393B2
    公开(公告)日: 2003-06-17
  • 发明人: Terry N. TiegsJames O. Kiggans, Jr.
  • 申请人: Terry N. TiegsJames O. Kiggans, Jr.
  • 主分类号: C04B3700
  • IPC分类号: C04B3700
High thermal conductivity lossy dielectric using co-densified multilayer configuration
摘要:
Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.
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