- 专利标题: Method and apparatus for exposing semiconductor wafers in a manner that promotes radial processing uniformity
-
申请号: US10008108申请日: 2001-11-13
-
公开(公告)号: US06580493B2公开(公告)日: 2003-06-17
- 发明人: Richard D. Holscher , Linda K. Somerville
- 申请人: Richard D. Holscher , Linda K. Somerville
- 主分类号: G03B2742
- IPC分类号: G03B2742
摘要:
A stepper device and method of using the stepper device in which a light source in the stepper generates an annular or multipole pattern of light having a relatively large coherency value that is used to expose inner fields of a photoresist-coated wafer. The light source generates an annular or multipole pattern of light having a relatively small coherency that is used to expose outer fields of the wafer adjacent its edge. The use of light having a relatively small coherence value to expose the outer fields of the wafer causes the exposure width of isolated features to be relatively large compared to the exposure width of dense features. As a result, after etching, the isolated features and the dense features can have the same width since etching is more effective for dense features.
公开/授权文献
信息查询