- 专利标题: Semiconductor device and method for fabricating the same
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申请号: US09886997申请日: 2001-06-25
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公开(公告)号: US06582991B1公开(公告)日: 2003-06-24
- 发明人: Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
- 申请人: Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
- 优先权: JP2000-380645 20001214
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.