Invention Grant
US06586873B2 Display panel module with improved bonding structure and method of forming the same 有权
具有改进的结合结构的显示面板模块及其形成方法

  • Patent Title: Display panel module with improved bonding structure and method of forming the same
  • Patent Title (中): 具有改进的结合结构的显示面板模块及其形成方法
  • Application No.: US09839118
    Application Date: 2001-04-23
  • Publication No.: US06586873B2
    Publication Date: 2003-07-01
  • Inventor: Kazuhiro MizutaniEiichi Kitazume
  • Applicant: Kazuhiro MizutaniEiichi Kitazume
  • Priority: JP2000-121919 20000424
  • Main IPC: H01J188
  • IPC: H01J188
Display panel module with improved bonding structure and method of forming the same
Abstract:
A display panel module includes a substrate, a circuit board, electrode terminals aligned in a first direction over a surface of the substrate, each of the electrode terminals extending in a second direction perpendicular to the first direction, lead terminals aligned in the first direction over a confronting surface of the circuit board to the substrate, at least an anisotropically conductive film sandwiched between the electrode terminals and the lead terminals, and a plurality of first electrically insulating walls on the substrate in at least selected plural ones of gaps between selected ones of the electrode terminals and on opposite side regions of the module, the opposite side regions being distanced in the first direction and separated by a center region. The first electrically insulating walls have a first height that is higher than a first total height of the electrode terminals and the anisotropically conductive film.
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