- 专利标题: Method of producing thermistor chips
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申请号: US09974272申请日: 2001-10-09
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公开(公告)号: US06588094B2公开(公告)日: 2003-07-08
- 发明人: Noboru Furukawa , Masahiko Kawase , Yasunori Ito
- 申请人: Noboru Furukawa , Masahiko Kawase , Yasunori Ito
- 优先权: JP10-290803 19981013
- 主分类号: H01C1700
- IPC分类号: H01C1700
摘要:
Thermistor chips are produced by preparing ceramic green sheets, applying an inorganic material such as a glass paste on these green sheets in areas including lines along which they are to be later cut, stacking a plurality of these green sheets one on top of another to obtain a stacked body, obtaining chips by cutting this stacked body along those pre-specified lines and subjecting these chips to a firing process to obtain sintered bodies, and forming outer electrodes on mutually opposite end surfaces of these sintered bodies. A thermistor chip thus produced has a thermistor element having outer electrodes on its mutually opposite end surfaces, and diffused layers of an inorganic material having a higher specific resistance than material of the thermistor element. These diffused layers are formed proximally to externally exposed surfaces of the thermistor element.
公开/授权文献
- US20020036564A1 Method of producing thermistor chips 公开/授权日:2002-03-28