- 专利标题: Liquid cooled circuit device and a manufacturing method thereof
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申请号: US10228295申请日: 2002-08-27
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公开(公告)号: US06588647B2公开(公告)日: 2003-07-08
- 发明人: Kazuji Yamada , Akihiro Tamba , Takayoshi Nakamura , Ryuichi Saito , Toshio Ogawa , Hisanori Okamura
- 申请人: Kazuji Yamada , Akihiro Tamba , Takayoshi Nakamura , Ryuichi Saito , Toshio Ogawa , Hisanori Okamura
- 优先权: JP2001-282543 20010918
- 主分类号: B23K2012
- IPC分类号: B23K2012
摘要:
A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.
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