发明授权
- 专利标题: Compound material frame body without the need of drilling holes
- 专利标题(中): 复合材料框架体无需钻孔
-
申请号: US10191561申请日: 2002-07-10
-
公开(公告)号: US06589125B1公开(公告)日: 2003-07-08
- 发明人: Ming-Jen Tsai
- 申请人: Ming-Jen Tsai
- 主分类号: A63B4910
- IPC分类号: A63B4910
摘要:
The present invention provides a compound material frame body without the need of drilling holes. A plurality of symmetric embedded tubes are clamped between two compound material pipe bodies. An outmost compound material layer sheathes the compound material pipe bodies and the embedded tubes with two openings of each of the embedded tubes being exposed. An integrally formed compound material frame body having through holes can immediately be obtained by blowing and heating in a mold. Because there is no need of drilling holes, the structure of the frame body will not be damaged. Moreover, the present invention can achieve the effects of simple manufacturing process, short manufacturing time, and reduced cost.