发明授权
US06589386B1 Device for processing wafer 失效
晶圆处理装置

Device for processing wafer
摘要:
A device for processing a substrate comprises a processing vessel (1), an outer vessel (2) for surrounding the processing vessel (1) which outer vessel (2) can be sealed, a first supporting member (4) for bringing the substrate (3) into and out from the processing vessel (1) which first supporting member (4) supports the substrate (3) in a standing manner, and a second supporting member (5) for transferring the substrate (3) between the first supporting member (4) which second supporting member (5) is movable up and down within the processing vessel (1). The device processes the entire surface of the substrate (3) uniformly and prevents varying in processing from occurrence.
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