发明授权
- 专利标题: Device for processing wafer
- 专利标题(中): 晶圆处理装置
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申请号: US09601993申请日: 2000-08-11
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公开(公告)号: US06589386B1公开(公告)日: 2003-07-08
- 发明人: Norio Maeda , Masao Oono , Hiroshi Aihara
- 申请人: Norio Maeda , Masao Oono , Hiroshi Aihara
- 优先权: JP10-352593 19981211
- 主分类号: H01L2168
- IPC分类号: H01L2168
摘要:
A device for processing a substrate comprises a processing vessel (1), an outer vessel (2) for surrounding the processing vessel (1) which outer vessel (2) can be sealed, a first supporting member (4) for bringing the substrate (3) into and out from the processing vessel (1) which first supporting member (4) supports the substrate (3) in a standing manner, and a second supporting member (5) for transferring the substrate (3) between the first supporting member (4) which second supporting member (5) is movable up and down within the processing vessel (1). The device processes the entire surface of the substrate (3) uniformly and prevents varying in processing from occurrence.
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