发明授权
- 专利标题： Packaging structure and method of packaging electronic parts
- 专利标题（中）： 包装电子零件的包装结构和方法
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申请号： US09640647申请日： 2000-08-18
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公开(公告)号： US06589802B1公开(公告)日： 2003-07-08
- 发明人: Toyoki Asada , Yuji Fujita , Kie Ueda , Naoya Kanda , Mari Matsuyoshi
- 申请人： Toyoki Asada , Yuji Fujita , Kie Ueda , Naoya Kanda , Mari Matsuyoshi
- 优先权： JP11-366227 19991224
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.
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