发明授权
- 专利标题: Use of low-high slurry flow to eliminate copper line damages
- 专利标题(中): 使用低 - 高泥浆流量来消除铜线损坏
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申请号: US09304302申请日: 1999-05-03
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公开(公告)号: US06589872B1公开(公告)日: 2003-07-08
- 发明人: Jih-Churng Twu , Ying-Ho Chen , Tsu Shih , Syun-Ming Jang
- 申请人: Jih-Churng Twu , Ying-Ho Chen , Tsu Shih , Syun-Ming Jang
- 主分类号: H01K2120
- IPC分类号: H01K2120
摘要:
The invention teaches a new method of applying slurry during the process of chemical mechanical polishing of copper surfaces. By varying the rate of slurry deposition, starting out with a low rate of slurry flow that is increased as the polishing process proceeds, the invention obtains good planarity for copper surfaces while saving on the amount of slurry that is being used for the copper surface polishing process.