发明授权
US06591495B2 Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
有权
具有由激光器制成的开口并使用化学镀和电解电镀的多层印刷电路板的制造方法
- 专利标题： Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
- 专利标题（中）： 具有由激光器制成的开口并使用化学镀和电解电镀的多层印刷电路板的制造方法
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申请号： US09797916申请日： 2001-03-05
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公开(公告)号： US06591495B2公开(公告)日： 2003-07-15
- 发明人: Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
- 申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
- 主分类号： H05K302
- IPC分类号： H05K302
摘要：
An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.