Invention Grant
- Patent Title: Board-to-board electrical coupling with conductive band
- Patent Title (中): 与导电带的板对板电耦合
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Application No.: US09409978Application Date: 1999-09-30
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Publication No.: US06594152B2Publication Date: 2003-07-15
- Inventor: David Dent
- Applicant: David Dent
- Main IPC: H01R1216
- IPC: H01R1216

Abstract:
A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.
Public/Granted literature
- US20020012239A1 BOARD-TO-BOARD ELECTRICAL COUPLING WITH CONDUCTIVE BAND Public/Granted day:2002-01-31
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