- 专利标题： Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
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申请号： US09962245申请日： 2001-09-26
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公开(公告)号： US06596381B2公开(公告)日： 2003-07-22
- 发明人: Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
- 申请人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
- 优先权： JP2000-294027 20000927
- 主分类号： B32B300
- IPC分类号： B32B300
摘要：
A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.