A process for producing a monolithic ceramic electronic component, which includes: providing a ceramic slurry, a conductive paste, and a ceramic paste; forming a plurality of composite structures each comprising a ceramic green sheet produced by shaping the ceramic slurry, internal circuit element films formed by applying the conductive paste partially onto a main surface of the ceramic green sheet so as to provide step-like sections, and a ceramic green layer which compensates for spaces defined by the step-like sections, the ceramic green layer being formed by applying the ceramic paste onto the region on the main surface of the sheet on which the element films are not formed, so as to substantially compensate for the spaces; forming a green laminate by laminating the composite structures; and firing the green laminate, wherein the ceramic paste contains ceramic powder, an organic solvent, and an organic binder. A monolithic ceramic electronic component produced through the process; a ceramic paste; and a production process for the ceramic paste are also disclosed.